// Global Analysis Archive
At ISCAS 2026, Huawei executive He Tingbo said the company will launch a new Kirin smartphone chip in autumn 2026 using logic folding for the first time. The chip is expected to debut in the Mate 90 series around September and is positioned to compete with Apple’s iPhone 18 lineup.
Taiwanese media report that Samsung Chairman Lee Jae-yong led a discreet May 21 visit to MediaTek to pursue foundry orders. The reported strategy involves offering preferential access to Samsung memory for next-generation Dimensity platforms in exchange for foundry business, echoing a prior bundling approach used with Qualcomm.
Xiaomi CEO Lei Jun said the company’s 3nm Xuanjie O1 smartphone SoC has surpassed one million shipments and is already used across three flagship devices. Xiaomi plans to extend the Xuanjie chip series into EVs and other smart devices with annual upgrades, indicating a broader vertical-integration strategy.
At ISCAS 2026, Huawei executive He Tingbo said the company will launch a new Kirin smartphone chip in autumn 2026 using logic folding for the first time. The chip is expected to debut in the Mate 90 series around September and is positioned to compete with Apple’s iPhone 18 lineup.
Taiwanese media report that Samsung Chairman Lee Jae-yong led a discreet May 21 visit to MediaTek to pursue foundry orders. The reported strategy involves offering preferential access to Samsung memory for next-generation Dimensity platforms in exchange for foundry business, echoing a prior bundling approach used with Qualcomm.
Xiaomi CEO Lei Jun said the company’s 3nm Xuanjie O1 smartphone SoC has surpassed one million shipments and is already used across three flagship devices. Xiaomi plans to extend the Xuanjie chip series into EVs and other smart devices with annual upgrades, indicating a broader vertical-integration strategy.
| ID | Title | Category | Date | Views | |
|---|---|---|---|---|---|
| RPT-4821 | Huawei Signals Logic-Folding Kirin Chip for Mate 90, Targeting Premium Smartphone Showdown | Huawei | 2026-05-25 | 0 | ACCESS » |
| RPT-4804 | Samsung Reportedly Courts MediaTek with Memory-for-Foundry Deal to Win Dimensity Orders | Semiconductors | 2026-05-23 | 0 | ACCESS » |
| RPT-4283 | Xiaomi Signals Scale in 3nm In-House SoC as Xuanjie O1 Shipments Pass One Million | Xiaomi | 2026-04-28 | 0 | ACCESS » |