Apple’s ‘Baltra’ AI Server Chip: TSMC N3E Manufacturing and Glass Substrate Signals a Push to Reduce GPU Dependence
Apple and Broadcom are reportedly developing an AI server chip codenamed “Baltra,” expected to be manufactured by TSMC on the N3E 3nm process and potentially use Samsung Electro-Mechanics’ glass substrate. The chip is anticipated to debut in Apple’s security-focused cloud infrastructure to reduce reliance on costly NVIDIA GPUs and lower data center operating costs.